Carr W.N. – TechConnect Briefs

Process for Extremely Thin Silicon-on-Insulator Wafer

Usenko A.Y., Carr W.N., Chen B., Silicon Wafer Technologies, Inc., US

We observe hydrogen platelets buildup into single crystalline silicon caused by hydrogen plasma processing. The platelets are aligned along a layer of lattice defects formed in silicon before plasma processing. The buried defect layer is [...]

Modeling and Simulation of A Surface Micromachined Triaxial Accelerometer

Jiang L., Carr W.N., New Jersey Institute of Technology, US

We present the modeling and simulation results in designing a surface micromachined, capacitive triaxial accelerometer. Electrical FEA simulations calculate the nominal values of the sensing capacitors and compared with parallel-plate analytical model. The mechanical static [...]