Silicon on ceramics – a new concept for micro-nano-integration on wafer level
Fischer M., Bartsch de Torres H., Pawlowski B., Mach M., Gade R., Barth S., Hoffmann M., Müller J., Technische Universitat Ilmenau, DE
A new integration concept for silicon devices to ceramic substrates based on a new bonding technique between nano-scaled, modified Black Silicon and an adapted, unfired LTCC substrate is presented. The novel technique enables to combine [...]