Aspect Ratio Improvement using the 2-step NERIME FIB Top Surface Imaging Process for Nano-lithography Applications
Arshak A., Arshak K., Gilmartin S.F., Collins D., Korostynska O., Arshak A., Arshak K., University of Limerick and Analog Devices, IE
The 2-step NERIME FIB top surface imaging process uses Ga+ ion implantation into resist followed by O2 plasma dry development using reactive ion etching. Previous work has demonstrated this process using 1.5um thick films of [...]