TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAffiliationsTokyo Institute of Technology

Affiliations: Tokyo Institute of Technology

Introduction of Micro-Manipulation by Adhesional Force and Dielectric Force

Takahashi K., An Y., Saito S., OnzawaTadao T., Tokyo Institute of Technology, JP
This paper reports the manipulation by both adhesional force and Coulomb force. Applicability of this method is discussed evaluating both of the forces theoretically and experimentally. Adhesional force can be used as attractive force in [...]

Mathematical Modeling the Dynamics of Recombinant Endonuclease Production in Microsystems

Ohtaguchi K., Asami K., Tokyo Institute of Technology, JP
A mathematical model for the dynamics of micro-scale production of recombinant human DNase I is formulated. In experiments extracellular production of human DNase I gene product from methylotrophic yeast Pichia pastoris GS115 has been achieved. [...]

Mechanical and Electronic Properties of Strained Layer Superlattices Studied by Density Functional TB and Path Probability Methods

Masuda-Jindo K., Kikuchi R., Tokyo Institute of Technology, JP
The atomic and electronic structures of semiconductor heterostructures including steps, misfit dislocations and interface disorder are studied by using the density-functional tight-binding (TB) method. Atomic structures of misfit dislocations both edge type 1/2 (001) and [...]

Computer Simulation Study of Mechanical Properties of Nanoscale Materials by Molecular Dynamics and Lattice Green’s Function Methods

Masuda-Jindo K., Menon M., Hung V-V, Tokyo Institute of Technology, JP
The mechanical properties of nanoscale materials are studied using the molecular dynamics and lattice Green’s function methods. The initial atomic structures of the dislocations and cracks are determined both from the elastic solutions as well [...]

Posts pagination

« 1 2

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.