Technical University of Münich – TechConnect Briefs

Combined Device- and System-level Simulation of RF MEMS Switches

Schrag G., Künzig T., Niessner M., Wachutka G., Technical University of Münich, DE

We present two problem-adapted, tailored modeling approaches for RF-MEMS switches which, in principle, are applicable to any capacitive MEMS device. They are based on finite element analysis (FEA) combined with analytical, lumped-element, and reduced-order modeling [...]

Modeling Strategies for Microsystems

Voigt P., Schrag G., König E-R, Wachutka G., Technical University of Münich, DE

A hierarchical approach to microsystem modeling is outlined. On the device level, the operating behavior is analyzed on the basis of continuous field models To deal with the coupling effects typical of microsystems, various coupling [...]

Modeling of a Piezo Paddle Mikro Pump

Ederer I., Technical University of Münich, DE

In this paper an analytical method will be presentea to describe the behavior of a piezo electric paddle pump. For that, mechanical and fluidic mechanism are combined in a one mass oscillator model with fluidic [...]

Validation and Calibration of Electrothermal Device Models Using Infrared Laser Probing Techniques

Thalhammer R., Fürböck C., Seliger N., Gornik E., Wachutka G., Technical University of Münich, DE

As it has recently been demonstrated, the internal distribution of carrier concentration and temperature is accessible to accurate measurements by various infrared laser probing techniques. In this work we present an advanced method for the [...]