TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeAffiliationsSamsung Electronics Co.Ltd.

Affiliations: Samsung Electronics Co.Ltd.

Diameter controlled synthesis of carbon nanotubes by CVD using steric-stabilized iron nanoparticle catalysts

Mayya K.S., Lee S., Yeo I-S, Chung U-I, Moon J.T., Samsung Electronics Co.Ltd., KR
Carbon nanotubes (CNT) are the subject of intensive investigation due to their potential applications in nanoelectronics, biological sensors, high performance materials etc. CNTs can be synthesized using variety of techniques of which synthesis using chemical [...]

Uniform Nanoparticle based Monolayers Deposited by a Modified Spin Coating Technique

Subramanya Mayya K., Yeo I-S, Chung U-I, Moon J.T., Samsung Electronics Co.Ltd., KR
A method for deposition of uniform monolayers of cobalt nanoparticles (size ~ 10 nm) with uniformity in the nanoscale upto the macroscale is demonstrated on a 6" wafer by a modified spin coating method. The [...]

Modeling and Dynamic Simulation of Electrostatically Driven Micromirror

Kweon S., Lee H., Shin H., Samsung Electronics Co.Ltd., US
Dynamic behavior of the electrostatically driven bi-directional micromirror system was simulated with ANSYS parametric design language. The objective of the study is to construct a dynamic simulation scheme for the transient properties of electrostatically coupled [...]

Systematic Global Calibration of a Process Simulator

Lee J-H., Lee S-W., Kim K-D., Kim Y-W., Kong J-T., Lee J-H., Lee S-W., Kim K-D., Kim Y-W., Baek D-H., Samsung Electronics Co.Ltd., KR
This paper proposes a novel methodology of systematic global calibration of a process simulator and validates its accuracy and efficiency with application to memory and logic devices. With 175 SIMS profiles which cover the whole [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.