Palo Alto Research Center – TechConnect Briefs

Acoustic Power Recovery System for Thermoacoustic Cooling

Schwartz D.E., Garner S.R., Johnson J.R., Tuganov A.V., Palo Alto Research Center, US

In this work, we present a novel zero global-warming-potential, high efficiency thermoacoustic heat pump that can replace vapor compression systems for conventional air conditioning and refrigeration.

Acoustic Power Recovery System for Thermoacoustic Cooling

Schwartz D.E., Garner S.R., Johnson J.R., Tuganov A.V., Palo Alto Research Center, US

In this work, we present a novel zero global-warming-potential, high efficiency thermoacoustic heat pump that can replace vapor compression systems for conventional air conditioning and refrigeration.

Innovative Cost-effective Pre-treatment for Desalination

Lean M.H., Seo J., Kole A., Volkel A.R., Chang N., Hsieh B., Melde K., Palo Alto Research Center, US

This paper describes an innovative technology to pre-treat feed water for desalination. An inline coagulation-flocculation-separation (CFS) system is detailed that does not require filtration or sedimentation. Advantages include: scalability, modularity, rapid processing, low energy, and [...]

Innovative Cost-effective Pre-treatment for Desalination

Lean M.H., Seo J., Kole A., Volkel A.R., Chang N., Hsieh B., Melde K., Palo Alto Research Center, US

This paper describes an innovative technology to pre-treat feed water for desalination. An inline coagulation-flocculation-separation (CFS) system is detailed that does not require filtration or sedimentation. Advantages include: scalability, modularity, rapid processing, low energy, and [...]

Micro Crumples for Self-Assembly of Field Emission Devices

Sambandan S., Palo Alto Research Center, US

We study the electrostatic properties of crumpled conducting films, in particular the effective vertical electric field. The inspiration for this work is the possibility of self-organizing field emission devices with aims to reduce the cost [...]

Jet-printed Si nanowires for flexible backplane applications

Wong W.S., Raychaudhuri S., Sambandan S., Lujan R., Street R.A., Palo Alto Research Center, US

The integration of Si nanowire (Si NW) materials with low-temperature plastic substrates can enhance the performance of low-cost flexible electronics. We report the properties of Si NW field-effect transistors (FETs) fabricated with various contact metals [...]

Affiliations: Palo Alto Research Center

Acoustic Power Recovery System for Thermoacoustic Cooling

Acoustic Power Recovery System for Thermoacoustic Cooling

Innovative Cost-effective Pre-treatment for Desalination

Innovative Cost-effective Pre-treatment for Desalination

Micro Crumples for Self-Assembly of Field Emission Devices

Jet-printed Si nanowires for flexible backplane applications

Energy-efficient electrochemical CO2 capture from the atmosphere

Energy-efficient electrochemical CO2 capture from the atmosphere

Effective Use of Focused Ion Beam (FIB) in Investigating Fundamental Mechanical Properties of Metals at the Nano-Scale