National Sun Yat-Sen University – TechConnect Briefs

Fabrication of Self-powered Heterostructure MoS2/Cu2O Photoelectrochemical Biosensor

Kuo C-Tng, Gong Q-H, Pan R-Y, Wang H-C, National Sun Yat-Sen University, TW

In this study, chemical vapor deposition (CVD) was used to grow the MoS2 thin films, and electrochemical deposition was used to grow the Cu2O thin films. We applied mechanical grinding to polishing the surface of [...]

Channel-to-rib width ratio effects of flowfield plates in the performance of a micro-PEM fuel cell stack

Her B.-S., Hsieh S.-S., Chen J.H., National Sun Yat-Sen University, TW

Effect of channel-to-rib width ratio of flowfield plates on micro proton exchange membrane fuel cell stacks performance test (VI/PI) was studied experimentally in the present study (see Fig. 1). The channel-to-rib width ratio was varied [...]

Two-Phase Convective Heat Transfer in Microchannels

Lin C.Y., Hsieh S.-S., Chen J.H., National Sun Yat-Sen University, TW

Experiments were conducted to investigate subcooling flow boiling in 75 parallel microchannels (L=30 mm) having 200 μm (W) x 100 μm (H) cross-section with/without structured reentrant angle ( 0°、60°、90°and 120°). Boiling inceptions, flow morphologies, critical [...]

Channel-to-rib width ratio effects of flowfield plates in the performance of a micro-PEM fuel cell stack

Her B.-S., Hsieh S.-S., Chen J.H., National Sun Yat-Sen University, TW

Effect of channel-to-rib width ratio of flowfield plates on micro proton exchange membrane fuel cell stacks performance test (VI/PI) was studied experimentally in the present study (see Fig. 1). The channel-to-rib width ratio was varied [...]

High-density Optical Disk Mastering Using Electron Beam Lithography with Modified LIGA Demolding Mechanism

Chao C.H., Pan C.T., National Sun Yat-Sen University, TW

In the study, a spiral nano-groove with 110nm in linewidth and 80nm in depth has been successfully fabricated. This method, Optical disk mastering using electron beam lithography, could provide about 50Gbytes storage capacity and is [...]

Microcap Selective Packaging through Flip Chip Alignment

Chao C.H., Pan C.T., National Sun Yat-Sen University, TW

In this study, the technique of microcap selective bonding for 3-D microstructures using MEMS processes was presented. The flip-chip assembly was successfully demonstrated that the microcap transferred on the selective area of the host substrate [...]