Münich University of Technology – Page 2

Investigation of Cross-Coupling and Parasitic Effects in Microelectromechanical Devices on Device and System Level

Schrag G., Zelder G., Wachutka G., Münich University of Technology, DE

With progressing monolithic integration of entire micro-electromechanical systems on one chip fabricated by standard IC technology we have to cope with the problem that the operation of embedded transducer elements is considerably affected by cross-coupling [...]

Methodology of Macromodeling Demonstrated on Force Feedback S/D-Architectures

Hardtmann M., Aigner R., Nadal R., Wachutka G., Münich University of Technology, DE

Design and verification of complete microsystems require effective models of the micromechanical components for the simulation at system level. Particularly for force feedback S/D-architectures, long transient simulations are inevitable to characterize the system-inherent signal pro-cessing. [...]

Simulation of Orientation-Dependent Etching of Silicon Using a New Step Flow Model of 3D Structuring

Horn A., Schröder H., Obermeier E., Wachutka G., Münich University of Technology, DE

We present a new model of three-dimensional orientation-dependent etching of Si{100}. Recent experimental results suggest to conceive etching as a “peeling” process of terraced planes, leading to the concept of a “step flow model of [...]

Physically Rigorous Modeling of Sensing Techniques Exploiting the Thermo-Optical and Electro-Optical Effect

Thalhammer R., Hille F., Scheubert P., Wachutka G., Münich University of Technology, DE

The complex refractive index in semiconductors depends on several electrical, thermal, and mechanical state variables, e. g. carrier concentrations, lattice temperature, or mechanical stress. Making use of these dependencies, various internal laser probing techniques and [...]

Analysis of Unstable Behavior Occurring in Electro-Mechanical Microdevices

König E-R, Wachutka G., Münich University of Technology, DE

We analyze the instability which is inherent to electrostatically driven microdevices. Further, we propose a homotopy method to overcome this difficulty during simulation of these devices. Starting from a simplified model, the governing differential equations [...]

Transient Electromagnetic Behaviour of Multiply Contacted Interconnects

Böhm P., Wachutka G., Münich University of Technology, DE

This paper presents a methodology for the analysis of the transient electromagnetic behavior of multiply contacted interconnects. It is shown that for applications with high switching frequencies and high pulse repetition rates with subsequent steep [...]

The Art of Modeling Coupled-Field Effects in Microdevices and Microsystems

Wachutka G., Münich University of Technology, DE

The rapid progress in microsystems technology is increasingly supported by MEMS-specific modeling methodologies and dedicated simulation tools. These do not only allow the visualization of fabrication processes and operational principles, but they also assist the [...]