Czech Technical University – TechConnect Briefs

Design and Simulation of the GaAs Micromechanical Thermal Converter for Microwave Transmitted Power Sensor

Jakovenko J., Husak M., Burian E., Lalinsky T., Czech Technical University, CZ

In this project we discuss the thermomechanical simulations performed in the aim of optimising the GaAs based Micromechanical Thermal Converter that creates heart of Microwave Transmitted power sensor. Conception of the absorbed power measurement is [...]

Concept of an Intelligent Microsystem Structure for Communication with Real Surrounding Space

Husak M., Jakovenko J., Czech Technical University, CZ

In the paper, concept of intelligent microsystem structure is presented. This concept is applicable in general surrounding environment. Concrete model of an intelligent temperature microsystem for control purposes is designed. Microsystem function has been verified [...]