Advanced Microsystem Packaging and Nano-Mechanics Research Laboratory, National Tsing Hua University

Investigation of the ssDNA Backbone Molecule Mechanical Behavior Using Atomistic-Continuum Mechanics Method

Chiang K.N., Chou C.Y., Han C-N, Wu C-J, Advanced Microsystem Packaging and Nano-Mechanics Research Laboratory, National Tsing Hua University, TW

As is known, various important physiological functions and gene engineering processes, such as RNA transcription/DNA replication/DNA repair, involve specific bio-physical mechanics of DNA. Therefore, in this study, a novel single-stranded DNA (ssDNA) model based on [...]

Investigation of Carbon Nanotube Mechanical Properties Using Atomistic-Continuum Mechanics Method

Chiang K.N., Chou C.Y., Han C-N, Wu C-J, Advanced Microsystem Packaging and Nano-Mechanics Research Laboratory, National Tsing Hua University, TW

This paper utilizes atomistic-continuum mechanics method (ACM) to investigate the mechanical properties of single-walled carbon nanotubes (SWCNTs). Fundamental to the proposed concept is the perception that a carbon nanotube is a geometrical frame-like structure, and [...]