US – Page 421 – TechConnect Briefs

Size and Strain Rate Effects in Tensil Deformation of Cu Nanowires

Liang W., Zhou M., Georgia Institute of Technology, US

Nanoscale plasticity has drawn significant attention in recent years. Extensive Experimental and numerical studies have been conducted in this field. In previous molecular dynamics (MD) simulations, the Nose-Hoover isothermal procedure was often used to maintain [...]

Air Damping in an Ultra-High-Frequency Disk Resonator

Yap L.K., Yap L.Y., Yap L.K., Yap L.Y., Ye W., Georgia Institute of Technology, US

In this paper we investigate the air damping in a circular disk radially oscillating at 1GHz. First the compressibility effects of air between the disk and the substrate are studied. The pressure perturbation along the [...]

Superharmonic Resonance of an Electrically Actuated Resonant Microsensor

Abdel-Rahman E.M., Nayfeh A.H., Virginia Polytechnic Institute and State University, US

We investigate the response of a microbeam-based resonant sensor to a superharmonic electric actuation. The model incorporates the nonlinearities associated with moderately large displacements and electric forces. The method of multiple scales is used to [...]

Symmetry and Symmetry Breaking in Electrostatically Actuated MEMS

Pelesko J.A., Bernstein D.H., McCuan J., University of Delaware, US

We investigate the symmetry of solutions to the small aspect ratio approximate model of electrostatic actuation. We find that for an annular shaped domain asymmetric solutions may occur.

Very Large Scale Integration of MOEMS Mirrors, MEMS Angular Amplifiers and High-voltage, High-density IC Electronics for Photonic Switching

Bryzek J., Nasiri S., Flannery A., Kwon H., Novack M., Marx D., Sigari El, Chen E., Garate J., Transparent Networks, US

The demand for communication bandwidth together with advances in MEMS (micro-electro-mechanical systems) technology has spurred rapid development in the field of MOEMS (micro-optical-electrical mechanical systems). One exciting opportunity is in the area of photonic switching. [...]

Tilt-angle Stabilization of Electrostatically Actuated Micromechanical Mirrors

Chen J.H., Weingar W., Azarov A., Giles R.C., Agere Systems, US

Recently proposed optical subsystems utilizing micro-electromechanical components are being developed for use in photonic crossconnects, optical add/drop multiplexers, and spectral equalizers. Common elements to these subsystems are electrostatically actuated micromechanical tilt mirrors that steer optical [...]

Design and fabrication of an integrated CMOS-MEMS 3-axis accelerometer

Xie H., Fedder G.K., Pan Z., Frey W., University of Florida, US

This paper reports a novel single structure, three-axis sensing accelerometer based on post-CMOS process. The resultant device incorporates both thin-film structures and bulk Si structures to achieve three-axis acceleration sensing without extra front-side lithography, or [...]

System Level Simulation of Mixed-signal Multi-domain Microsystems with Piecewise Linear Behavioral Models

Kurzweg T.P., Levitan S.P., Davare A.J., Kahrs M., Chiarulli D.M., University of Pittsburgh, US

The creation of simulation tools for mixed-signal, multi-domain (MSMD) systems is challenging because these systems span the physical domains of electronics, photonics, fluidics, and mechanics, as well as multiple orders of magnitude in both time [...]

Magnetic Diffusion in Nonlinear Micro-Media: A Modified Finite-Difference Time-Domain Approach

Cros F., Allen M.G., Lang J.H., Massachusetts Institute of Technology, US

As flux densities and frequencies are raised to increase the performance of magnetic micro-actuators, micro-motors/generators, and micro-inductors, eddy currents and magnetic saturation start to limit the performance of these devices. In this paper, we present [...]

The Monolithic Integration of 6H-SiC Electronics with 6H-SiC MEMS for Harsh Environment Applications

Hailu E., Atwell A.R., Duster J.S., Li C., Balseanu M., Kornegay K.T., Cornell University, US

We report the development of a design and fabrication methodology for the first monolithic integration of silicon carbide (SiC) MEMS sensors with SiC-based electronic amplification and control circuitry. MEMS and circuit integration on silicon has [...]