United Kingdom
Evaluation of Garofalo creep model for lead-free solder joints in surface mount components
This investigation employs four hyperbolic sine creep constitutive models to simulate the deformation in Sn[3.0-4.0%]Ag[0.5-1.0%]Cu solder joints of two surface mount components assembled on printed circuit board. These creep models are proposed by Schubert et [...]