JP – Page 23 – TechConnect Briefs

Nanoscale Reaction Analysis of Resist Materials for Nanolithography

Kozawa T., Saeki A., Okamoto K., Tagawa S., Osaka University, JP

Recently, in semiconductor industry, elaborate extension of photolithography is getting closer to its capacity limit and post-optical lithographies have attracted much attention ever. Because they are capable of fabricating features below 32 nm, they are [...]

Growth and Characterization of GaAs/AlGaAs Core-Shell Nanowires and AlGaAs Nanotubes

Noborisaka J., Motohisa J., Hara S., Fukui T., Hokkaido University, JP

We report on the fabrication of GaAs/AlGaAs core-shell nanowires (NWs) and AlGaAs nanotubes by SA-MOVPE and their photoluminescence characterization. The fabrication started from a preparation of patterned GaAs (111) B substrates partially covered with SiO2 [...]

Novel Nonvolatile Logic Circuits with Three-Dimensionally Stacked Nanoscale Memory Device

Abe K., Fujita S., Lee T.H., Toshiba Corporation, JP

Various emerging memories have been proposed for ultra high-density memory, such as phase change memory, organic memory or resistive memory. However, the potential of the emerging memories is not limited to RAM only. We have [...]

Two-Dimensional Simulation of Tunneling Using Quantum Lattice-Gas Automata

Sakai A., Kamakura Y., Taniguchi K., Osaka University, JP

We present the two-dimensional simulation of quantum tunneling considering the rough surface. It is demonstrated that the electron transmission through the potential barrier is significantly affected by the surface roughness pattern even if the same [...]

Large Scale Simulation of the Nano-Scale High-Temperature-Superconductor Device for the Generating of Continuous Terahertz Waves

Iizuka M., Tachiki M., Minami K., Tejima S., Nakamura H., Research Orgnization Science and Technology, JP

Continuous terahertz waves have important applications in scientific and industrial fields such as medicine and information technology. Many methods (the quantum cascade laser and the photomixing method, etc.) are developed as a continuous terahertz wave [...]

Application of Magnetic Neutral Loop Discharge Plasma in Deep Quartz and Silicon Etching Process for MEMS/NEMS Devices Fabrication

Morikawa Y., Hayashi T., Suu K., Ishikawa M., ULVAC, Inc., JP

ULVAC’s Si deep etching technique has achieved high etching rate as high as 20 um/min as well as extremely high selectivity over resist mask as high as 100 or higher ensuring good etching performance.

Evaluation of Manipulation Probes for Expanding the Range of Capillary Force

Obata K.J., Saito S., Takahashi K., Tokyo Institute of Technology, JP

It is difficult to manipulate a micro-sized object precisely with conventional tools, because the gravity effect becomes extremely small compared to the adhesional one. Therefore, in order to perform reliable micromanipulation, we need to use [...]

A Micromanipulation Method based on the Capillary Force by Phase Transition

Katsuda O., Saito S., Takahashi K., Tokyo Institute of Technology, JP

The size of an object has decreased in the electrical and mechanical engineering field for fabricating highly functional microelectro-mechanical systems and photonic crystals. In micromanipulation, even if we can pickup micro-objects, it is very difficult [...]

Preparation and Property of Novel CMC-tactile Sensors

Chen X., Yang S., Motojima S., Gifu University, JP

Carbon microcoils/nanocoils (CMC) have an interesting anisotropic morphology of 3D-herical/spiral structure such as a DNA or proteins. The CMC have double-helix or single-helix structure with a coil diameter of 0.05-10 _m and a coil pitch [...]

Computing Encapsulation of Non-metallic Molecules: N2@C60

Slanina Z., Nagase S., Institute for Molecular Science, JP

Recent observation of N2@C60 is supported computationally. The geometry is optimized at the B3LYP/3-21G and PW91/3-21G levels. The lowest-energy structure has the N2 unit oriented towards a pair of parallel pentagons so that the complex [...]