Papers:
Influence of resist composition on demolding force in UV nanoimprint lithography
We investigated the influence of the Young’s Modulus (E) of UV resist on the measured demolding force in UV-NIL by varying compositions of UV-curable polymers. We found that decreasing crosslinking content of the polymers decreases [...]
Maskless Lithography Using Patterned Amorphous Silicon Layer Induced by Femtosecond Laser Irradiation
In this research, we reported a maskless lithography method by a combination of laser amorphization of silicon and wet alkaline etching. This technique can lead to a promising solution for maskless lithography because in comparison [...]
Micro Crumples for Self-Assembly of Field Emission Devices
We study the electrostatic properties of crumpled conducting films, in particular the effective vertical electric field. The inspiration for this work is the possibility of self-organizing field emission devices with aims to reduce the cost [...]
Monolithic CMOS MEMS technology development: A piezoresistive-sensors case study
Chaehoi A., Weiland D., O’Connell D., Bruckshaw S., Ray S., Begbie M., Institute for System Level Integration, UK
This paper presents the development of a monolithic CMOS-MEMS platform under the iDesign and SemeMEMS projects with the aim of jointly providing an open access “one-stop-shop” prototyping facility for integrated MEMS. This work addresses the [...]
Practical issues with ion beam milling in acoustic resonator technologies
A practical approach to addressing production issues of thickness trimming was demonstrated through two-step trimming, send-ahead wafer, and deposition/trimming cluster tool. Thickness control necessary in SAW/BAW technology was demonstrated.
Investigation on correlation between cold/hot weld line mechanical properties and micro injection molding processing parameters
Micro injection molding has been attracting more and more market attentions, due to realizing the large scale cost effective production of Micro Electronic Mechanic System (MEMS) components. However, there are some defects which cannot be [...]
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4398-3402-2