Gilmartin S.F., Arshak A., Arshak K., Collins D., Korostynska O., Arshak A., Arshak K.
Analog Devices, IE
Keywords: etch, ion beam lithography, nanolithography, NERIME, semiconductor fabrication, topography
The 2-step negative resist image by dry etching (2-step NERIME) focused ion beam (FIB) top surface imaging (TSI) process is a novel nanolithography technique for creating nanometer scale resist features using conventional DNQ/novolak resists. The 2-step NERIME process combines the advantages of FIB lithography and TSI processing, and delivers high aspect ratio nanometer-scale resist CDs. Previous work has reported 90nm resist critical dimensions (CDs) on topography using the 2-Step NERIME process. We present 90nm resist CDs over substrate topography, and demonstrate fabrication of 80nm etched features masked using the 2-step NERIME process.
The etched nanoscale features exhibit minimal line edge roughness (LER) and excellent profile control, and demonstrate the suitability of the 2-step NERIME process as a nanolithography technique for applications requiring nanometer feature CD and profile control. Such etched features are of potential use in a variety of applications such as nanosensors, NEMs, MEMs, DRAM, CMOS and BiCMOS processing.
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 7, 2006
Pages: 233 - 236
Industry sector: Advanced Materials & Manufacturing
Topic: Advanced Manufacturing
ISBN: 0-9767985-8-1