Bieniek T., Janczyk G.
Instytut Technologii Elektronowej, PL
Keywords: 90nm@300mm, BCD, CarrICool, IC design, integration, modelling, power delivery, power discretes, R3PowerUp, UAV
Smart power ICs are key enabling components for various applications from mid-power automotive, to industrial power, battery management systems electric vehicles, domotics, indoor and outdoor lighting, computers and industrial peripherals. Power electronics serves over 30% of the industrial semiconductors business acting as a stable market with growth estimation up to 134Billion US$ as the global demand for system power electronics is expected to reach 2% of the compound annual growth rate (CAGR) until the year 2020. At the moment, 300mm FABs for Smart Power devices are located or announced only in Asia and in the USA. The R3-POWERUP project will establish first pilot FAB 90nm@12” in Europe
Journal: TechConnect Briefs
Volume: 4, Informatics, Electronics and Microsystems: TechConnect Briefs 2018
Published: May 13, 2018
Pages: 63 - 66
Industry sector: Sensors, MEMS, Electronics
Topics: Advanced Manufacturing, Nanoelectronics
ISBN: 978-0-9988782-1-8