An overview of the types of UV laser processing as applied to the fabrication of miniature devices using advanced UV Excimer and UV DPSS lasers, will be presented. This discussion will include examples of high tolerance laser micromachining processes and an will overview the current technology of short pulse width industrial 266nm diode pumped solid state lasers and short wavelength excimer lasers at 193nm and 157nm. 3D micromachining, heat free etching and thin film patterning will be discussed. Using these relatively new lasers, high accuracy and high production rates are achieved in difficult materials such as fused silica, Teflon, sapphire, ceramics and diamond. Micro vias, die separation, microfluidic nossles, GaN lift off and high resolution thin film patterning processing are demonstrated. Cost effective rapid prototyping and production scale implementation of new micro devices are shown to be possible by the combination of advanced motion control, optics, lasers and software.
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: March 7, 2004
Pages: 518 - 520
Industry sector: Advanced Materials & Manufacturing
Topics: Advanced Manufacturing