Solvent-free Printing of Organic Semiconductor, Insulator, Metal, and Conductor Particles on Flexible Substrates

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Multi-material and solvent-free printing for printed electronics is developed using toner-type patterning of organic semiconductor, insulator, metal and other con- ductor particles, and the subsequent thin-film formation by ultrasonic sintering. Although conventional toner technology was only for insulating complex materials charged by friction charging, in this work, we expanded this technology for metals and other conductive materi- als, for example, graphite, carbon nanotube, graphene, ZnO, ITO, Au, Ag, Cu and so on. In the electrostatic transfer patterning, approximately 9 – 30 micrometer resolution pattern printing, which depends on the ma- terial, was achieved in our laboratory. High through- put and large area page printing are also expected in this type of technologies. Furthermore, ultrasonic sin- tering was also applied on the wide range of materials. Ultrasonic sintering is a powerful tool to melt organic semiconductor and insulators, and to sinter the oxide semiconductor or metal particles within several seconds. Ultrasonic sintering generates local and instantaneous high temperature at the material interface, so we can sinter even oxides and metals on plastic film surface.

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Journal: TechConnect Briefs
Volume: TechConnect Briefs 2019
Published: June 17, 2019
Pages: 361 - 364
Industry sector: Sensors, MEMS, Electronics
Topics: Nanoelectronics, Sensors - Chemical, Physical & Bio
ISBN: 978-0-9988782-8-7