Keywords: inclination sensor, silicon bulk microsystem, simulation
The design and development are supported by many simulation tools nowadays. The specific use of technology modeling and FEM-simulation for silicon bulk micromachining is contents of the paper. For this, the whole procedure between the idea and the industrial used sensor is demonstrated. The emphasis lays on the simulation of the orientation dependent etching with the simulation tool SIMODE and the interfaces to the FEM-simulation-tools. Furthermore the mechanical and thermal FEM-simulations of the sensor and of the packaging will be demonstrated. The special aspect is not the introduction of simulation models, but the demonstration of simulation runs for an industrial design of an inclination sensor and the occurred problems and founded solutions during the design.
Journal: TechConnect Briefs
Volume: Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems
Published: April 19, 1999
Pages: 102 - 104
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-4-6