Printing as an additive fabrication method has in recent years attracted a great deal of attentions both in research community and industrial sectors, because of its low-cost and the capability of manufacturing electronic devices on flexible substrates. One of the most critical components in printed flexible electronic circuits is the rectifying diode, which is proved to be extremely difficult due to problems such as inappropriate inks, clogging of printer nozzles, incompatible interface between printed layers, etc. In this paper, we report to use hybrid materials based on copper phthalocyanine (CuPc) as semiconductor layer for printing diodes on a flexible substrate, though CuPc has poor solubility in most solvents. The diode was printed on flexible polyimide foil. The bottom electrode was inkjet-printed using nanosilver ink. CuPc and PEDOT:PSS were dispersed in water as CuPc:PEDOT:PSS colloidal suspension, and printed onto the Ag electrode by an aerosol jet printer. The top electrode is made of a piece of aluminum foil covering on the hybrid layer. The current-voltage characteristics demonstrated that the printed diode has rectification ratio over 1000. These preliminary results are leading to deeper understanding of the hybrid CuPc material and its properties in printed flexible electronic devices.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 54 - 57
Industry sector: Sensors, MEMS, Electronics
Topicss: Nanoelectronics, Photonic Materials & Devices