We report a new method to deposit Cu nanocrystals by 5kV Ar+ ion sputtering of Cu metallic ribbons at glazing incidence, 8º, on top of (110) Si-substrates mechanical polished down to a 0.1 μm finish. The Si- substrate was placed into a rotating specimen holder at the same plane that the Cu ribbons and was maintained at liquid nitrogen temperature in an oil-free vacuum of 2×10-4 torr. The used glazing incidence of the Ar+ ions magnified the sputtering yield and the surface scratches induced by the mechanical polishing favoured the formation of a quasi-ordered array of nanodots.
Journal: TechConnect Briefs
Volume: 3, Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: May 7, 2006
Pages: 174 - 177
Industry sector: Advanced Materials & Manufacturing
Topic: Advanced Manufacturing