Mishin S., Oshmyansky Y., Bi F.
Advanced Modular Systems, Inc, US
Keywords: AlN, FBAR, ion milling, SiO2, trimming
A practical approach to addressing production issues of thickness trimming was demonstrated through two-step trimming, send-ahead wafer, and deposition/trimming cluster tool. Thickness control necessary in SAW/BAW technology was demonstrated.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Pages: 288 - 291
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4398-3402-2