Photonic Curing of Silver Nanoparticle Based Inks Deposited by M3D

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Photonic curing is uniquely suited to rapidly sinter printed films in an assembly line or roller environment. Previous work has focused on measuring the resistivity of films sintered using photonic curing and comparing those results to resistivities obtained using oven and laser sintering. We report on results of a series of experiments aimed at optimizing densification and conductivity of silver nanoparticle ink-based films made using direct write methods, and the results of simulations of the absorption and sintering processes which closely match experimental conditions. Our goal is to closely link simulations and experiments to optimize process development and reduce prototyping time and costs.

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Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Pages: 210 - 213
Industry sector: Advanced Materials & Manufacturing
Topics: Advanced Manufacturing, Nanoelectronics
ISBN: 978-1-4398-3402-2