Recent results in the microfluidics group at the Berkeley Sensor and Actuator Center and the Air Force Research Laboratory have shown that a micro-capillary pumped loop (micro-CPL) can move extreme amounts of heat (< 200 W/cm2) to provide integral cooling to electronics or MEMS type devices. However, the current design has not been optimized because of the time and cost of fabrication of prototypes. Furthermore, experimental results are not clear because they cannot separate different heat transfer effects such as convection and radiation. Numerical tools have been used to understand experimental results and are being implemented to improve this design and to shorten the design and fabrication process.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Published: March 19, 2001
Pages: 262 - 265
Industry sector: Sensors, MEMS, Electronics
Topics: Micro & Bio Fluidics, Lab-on-Chip