Designing small scale integrated systems for sensing and actuation has gained lots of interest in recent years. Currently, subsystems are fabricated separately and then bonded together to form an integrated platform. This poses a fundamental limit on the size and design of such systems and also on their longevity and performance. Here, we present a method of designing and fabricating such systems using standard electronic substrates to result in fully integrated systems. We present techniques to do lithography, etching, isolation, and deposition and surface functionalization for such small scale systems on integrated platforms. Special care needs to be taken in developing these methods to avoid any damage to the already present electronics on such substrates. These techniques provide a set of tool to convert such electronic systems into complete sensing/actuation platforms which can then be used for many different applications. Furthermore, the CMOS-compatibility of these techniques makes it possible to integrate these processes in commercial CMOS foundries to reduce the complexity of fabricating such systems and to improve their performance. Finally, we will show an example of sensing platform for blood analyte using these techniques.
Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2013: Bio Sensors, Instruments, Medical, Environment and Energy (Volume 3)
Published: May 12, 2013
Pages: 73 - 76
Industry sector: Medical & Biotech
Topics: Diagnostics & Bioimaging, Sensors - Chemical, Physical & Bio