Chaehoi A., Weiland D., O’Connell D., Bruckshaw S., Ray S., Begbie M.
Institute for System Level Integration, UK
Keywords: 3-axis accelerometer, CMOS, MEMS, Piezoresistive, pressure sensor, SOI
This paper presents the development of a monolithic CMOS-MEMS platform under the iDesign and SemeMEMS projects with the aim of jointly providing an open access “one-stop-shop” prototyping facility for integrated MEMS. This work addresses the implementation of a 3-axis accelerometer and a pressure sensor using Semefab in-house double-poly single-metal CMOS process on a 380/4/15μm SOI wafer; the membrane and the proof mass being micromachined using double-sided DRIE (Fig.1). This monolithic approach promises, in high volume production and using low complexity processes, a dramatic cost reduction over hybrid sensors. Furthermore, the embedded signal conditioning and the low-noise level in polysilicon gauges enables high performances to be achieved by implementing dedicated on-chip amplification and filtering circuitry.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Pages: 284 - 287
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4398-3402-2