Gauthier D., Mueller A., White R., Manno V., Rogers C., Anjur S., Moinpour M.
Tufts University, US
Keywords: chemical mechanical polishing, CMP, force sensors, MEMS
Two types of microscale sensors are being developed to take in situ measurements of forces induced during chemical mechanical polishing. Flexible post sensors have been demonstrated, and floating element sensors are under development. Both sensors will be included in this presentation. Presenting Author: Douglas Gauthier
Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2008: Microsystems, Photonics, Sensors, Fluidics, Modeling, and Simulation – Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: June 1, 2008
Pages: 462 - 465
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4200-8505-1