This paper describes a front venting MEMS pressure sensing array, fabricated through the MEMSCAP PolyMUMPS process. The microphone array will be used to analyze the turbulent boundary layer (TBL) of an airplane fuselage in wind tunnel simulations and during and actual flight testing. The application for the microphone array will be to achieve high wavenumber and high frequency temporal features of the in-flight TBL. This increase in spatial and temporal resolution will provide valuable characterization data of the TBL which will lead to the reduction of unwanted noise in airplane cabins. Joshua Krause will be the presenting author; Robert White will be the corresponding author.
Journal: TechConnect Briefs
Volume: 3, Nanotechnology 2008: Microsystems, Photonics, Sensors, Fluidics, Modeling, and Simulation – Technical Proceedings of the 2008 NSTI Nanotechnology Conference and Trade Show, Volume 3
Published: June 1, 2008
Pages: 170 - 173
Industry sector: Sensors, MEMS, Electronics
Topics: Sensors - Chemical, Physical & Bio