Mechanisms of Photonic Curing™: Processing High Temperature Films on Low Temperature Substrates


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Photonic Curing uses flashlamps to thermally process a thin film at high temperature on a low temperature substrate without damaging it. This has utility in printed electronics, where high temperature curing is generally equated to electronic performance and high speed processing is equated to low cost. Three significant processing advantages are realized over previous technologies: 1. Inexpensive (and flexible) polymer substrates can now be used in place of expensive, rigid substrates while achieving similar performance. 2. Thin films can be cured quickly enough to keep up with high speed printing processes in a small footprint, thus making it suitable for in-line placement with existing print systems. 3. The transient nature of the process has enabled the creation of new types of films on low temperature substrates, including those created by the photonic modulation of high temperature chemical reactions. In this paper we discuss the mechanisms of the process and model it using a thermal diffusion simulation. The simulation has been integrated into a 4th generation high-speed processing tool yielding predictive results.

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Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 220 - 223
Industry sector: Advanced Materials & Manufacturing
Topicss: Advanced Manufacturing, Nanoelectronics
ISBN: 978-1-4398-7139-3