Mechanical properties of PECVD Si3N4 thin films with rapid thermal annealing using finite element simulation

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The entire study includes Si3N4 specimen fabrication, material and mechanical characterization, a new physical model derivation, as well as the corresponding finite element analysis (FEA) and simulations. Nevertheless, the standard method used for nanoindentation were developed primarily for monolithic material. In this study, finite element analysis (FEA) was used to simulate the effect of residual stress on indentation test and develop an improved technique that nanoindentation will be widely applicable.

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Journal: TechConnect Briefs
Volume: 1, Nanotechnology 2011: Advanced Materials, CNTs, Particles, Films and Composites
Published: June 13, 2011
Pages: 20 - 23
Industry sector: Advanced Materials & Manufacturing
Topics: Materials Characterization & Imaging
ISBN: 978-1-4398-7142-3