Surface acoustic wave (SAW) devices have many applications and can be found in common consumer electronics such as mobile phones, WiFi and GPS. Beside its use in electronics they can also be used as a passive wireless sensor. For all applications it is a challenge to fabricate the devices with sufficiently low tolerances to reduce noise for filter/oscillator applications and to make calibration free devices for sensor applications. Commercial SAW devices are limited by optical lithography which is only possible to make devices with a frequency dispersion of 150 ppm. The goal is to develop a cost-effective, high throughput nano-manufacturing line based on Jet & Flash Nano Imprint Lithography (J-FIL) to reduce the frequency dispersion to less than 10 ppm. J-FIL has the advantage of being able create an almost perfect replica of a pre-fabricated stamp on the wafer. The stamp can be created using precision lithography techniques, which can fabricate lower tolerances and these fine structures can then inexpensively be transferred to the wafer. Here we will present the latest results on fabrication of SAW devices, where we have achieved a device variation down below 15 ppm, a factor 10 better than commercially available components.
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2013: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)
Published: May 12, 2013
Pages: 462 - 465
Industry sector: Advanced Materials & Manufacturing
Topicss: Advanced Manufacturing, Nanoelectronics