Hiwatari Y., Kaneko Y., Ohara K., Murakami T.
Kanazawa University, JP
Keywords: Monte Carlo simulation, thin film, via filling, voids
In this paper, we study the void formation during via filling as a model of copper damascene plating for LSI interconnects. We developed a new model for crystal growth which enables us to study the void structure in relation to the surface structure depending upon the deposition conditions. Using this model which we call Solid-by-Solid model, we performed the kinetic Monte Carlo simulations of filling V-shaped and flat-bottomed grooves to examine the surface and void structures during the surface growth. It is found that small voids appear successively in the film, being aligned to the growth direction as the V-shaped groove is filled with deposited atoms. In filling the flat-bottomed groove, on the other hand, large voids appear in the middle of the groove which are elongated to the growth direction. The mechanism of filling and void formation and its dependence on the shape of the initial substrate are discussed.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems
Published: April 22, 2002
Pages: 430 - 433
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9708275-7-1