The conventional technique used for manufacturing miniaturized ceramic components is the powder route which typically does not allow the fabrication of feature sizes smaller than 0.1mm. With the availability of pre-ceramic polymers, processed by various lithographic methods, it is possible to realize feature sizes below 1 μm in size on polymer derived ceramics (PDC). Recently, sub-500nm structures have been fabricated by soft lithography which uses a sacrificial mold. This method is not commercially viable for the production of sub-100nm feature devices in large numbers due to the tedious pre- and post processing steps involved. Currently, no studies are present in the direction of simply molding/printing the nanostructures below 100nm on Si3N4/SiO2 to the best of our knowledge. Here, we present a simple method of fabricating photonic devices in polysilazane (CERASET) which is a precursor for preparing Si3N4 and SiC. Easy and simple steps involved in our printing technique enable the fabrication of large area PDC nanostructures. Moreover, this technique can be a viable alternative to the expensive photolithographic technique for the fabrication of semiconductor device platforms and photonic devices.
Journal: TechConnect Briefs
Volume: 1, Nanotechnology 2012: Advanced Materials, CNTs, Particles, Films and Composites (Volume 1)
Published: June 18, 2012
Pages: 761 - 763
Industry sector: Advanced Materials & Manufacturing
Topics: Advanced Materials for Engineering Applications