In this works, we developed a top-down fabrication method to pattern and form carbon nanotube(CNT) interconnects with Cu encapsulation. Using this method, we fabricated spiral Cu-encapsulated CNT inductors for RF ICs and investigated the inductance of 0.55nH and quality(Q-) factor of 66 at 8.5GHz.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2007 NSTI Nanotechnology Conference and Trade Show, Volume 1
Published: May 20, 2007
Pages: 45 - 48
Industry sector: Advanced Materials & Manufacturing
Topics: Carbon Nano Structures & Devices