Development of Quantitative Adhesive Force Measurement Systems for Flexible Electronics

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In this paper, a novel adhesive force measurement system is developed to measure adhesive forces from interacting surfaces. In previous paper, the adhesive force was measured with tens/hundreds of uN, and the displacement was measured with tens of nm resolution. Here, we used a high resolution force sensor and a high resolution z-stage to increase sensitivity in adhesive force measurement with under a few uN and tens of nm resolution. The force measurement part is fixed on a uniformly drilling plate, which assembled manual z-stage, piezo z-stage, and force sensor. Using the force sensor in the adhesive force measurement system, a pull-off force of an adhesive layer is measured. At this time, we measured multiple sections of the 300 mm width film. Database, that is the measured pull-off force of each adhesive layer was created.

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Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Pages: 405 - 408
Industry sector: Sensors, MEMS, Electronics
Topics: Sensors - Chemical, Physical & Bio
ISBN: 978-1-4398-3402-2