Abo Ras M.
Berliner Nanotest and Design GmbH, DE
Keywords: greases pump-out, material aging, reliability test, thermal characterization, thermal conductivity, thermal Interface Materials, thermal resistance, TIM delamination
The on-going need for miniaturization and speed in electronics industry has brought a requirement for better performing thermal management systems. Therefore we have developed a test stand to characterize the aging behaviour of most common thermal interface materials (TIMs).
Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 13, 2011
Pages: 159 - 163
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 978-1-4398-7139-3