An Electrodeposition Method for Preparing (Ni-Cu) /(Cu-Ni) Multilayers on magnesium alloy from ionic liquid

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Abstract A single bath of ionic liquid electrodeposition method has been developed for the preparation of (Ni-Cu)/(Cu-Ni) multilayers on AZ91D magnesium alloy. The technique has been used to make multilayers with a composition of (92.47at.%Ni-7.53at.%Cu) /(53.23at.%Cu-46.77at.%Ni). Cyclic voltammetry studies revealed that Cu preferentially deposits to Ni belongs to a normal electrodeposition. The layer composition and thickness can be controlled by varying the electroplating current density and time. A uniform, smooth and dense nanocrystalline(Ni-Cu)/(Cu-Ni) multilayers exhibited an excellent corrosion protection due to the electrochemical synergistic effect between the (Ni-Cu)/(Cu-Ni) multilayers. The surface morphology, cross-section morphology and corrosion behaviors of the multilayers are discussed. Key words: Ionic Liquid, Electrodeposition, Multilayers, Magnesium Alloy.

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Journal: TechConnect Briefs
Volume: 1, Advanced Materials: TechConnect Briefs 2015
Published: June 14, 2015
Pages: 456 - 459
Industry sector: Advanced Materials & Manufacturing
Topics: Advanced Materials for Engineering Applications
ISBN: 978-1-4987-4727-1