This advanced thermal protector is based on the patent (U.C. Case No. 2012-130), which provides one-way heat flow function, i.e. enabling heat dissipation from the electronic devices, while preventing outside heat from thermally damaging the devices, see Fig. 1. This film can be thin around 1 mm, and fabricated to accommodate different level of temperature operation/protection. No power is required to energize the functions, it automatically enables its two major functions simultaneously. The cost varies at different temperature requirement. We have accomplished the proof-of-concept design/test, see Fig. 2. The mass production method is also available for commercialization. The flexible film can be used to protect electronic devices in battle fields, firefighting, and residential houses.
Journal: TechConnect Briefs
Volume: 1, Advanced Materials: TechConnect Briefs 2018
Published: May 13, 2018
Pages: 140 - 143
Industry sector: Advanced Materials & Manufacturing
Topics: Advanced Materials for Engineering Applications, Composite Materials