3D laser writing in-line process for the rapid fabrication of flexible electronic devices

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In this work, we present for the first time a new approach of a 3D direct laser writing which allows the patterning of several layers in a single step by adjusting the parameters of the laser in function of the optical properties of the materials. This approach was used for the fabrication of a flexible strain sensor and it is particularly adapted to the fabrication of flexible electronic devices where several layers and materials are required.

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Journal: TechConnect Briefs
Volume: 4, Advanced Manufacturing, Electronics and Microsystems: TechConnect Briefs 2015
Published: June 14, 2015
Pages: 131 - 134
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topics: Printed & Flexible Electronics
ISBN: 978-1-4987-4730-1