TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordstwo-dimensional analysis

Keywords: two-dimensional analysis

Simulation of Breakdown Characteristics of AlGaN/GaN HEMTs with Double Passivation Layers

Nakano K., Hanawa H., Horio K., Shibaura Institute of Technology, JP
It is well known that the introduction of field plate increases the breakdown voltage of AlGaN/GaN HEMTs. However, it increases the parasitic capacitance, leading to the degradation of high-frequency performance. As another way to improve [...]

Simulation of Breakdown Voltage Enhancement in AlGaN/GaN HEMTs with Double Passivation Layers

Horio K., Hanawa H., Shibaura Institute of Technology, JP
It is well known that the introduction of field plate increases the breakdown voltage of AlGaN/GaN HEMTs [1, 2]. However, it increases the parasitic capacitance, leading to the degradation of high-frequency performance. As another way [...]

Simulation of Lags and Current Collapse in Field-Plate AlGaN/GaN HEMTs with Different Types of Buffer Layers

Tsurumaki R., Noda N., Horio K., Shibaura Institute of Technology, JP
In AlGaN/GaN HEMTs, slow current transients are often observed even if the gate voltage VG or the drain voltage VD is changed abruptly. This is called gate lag or drain lag, and is problematic for [...]

Simulation of Current Slump Removal in Field-Plate GaAs MESFETs with a Thin Passivation Layer

Nomoto A., Sato Y., Horio K., Shibaura Institute of Technology, JP
In compound semiconductor FETs, slow current transients are often observed even if the drain voltage VD or the gate voltage VG is changed abruptly [1]. This is called drain lag or gate lag, and undesirable [...]

Simulation of Buffer Current Effects on Breakdown Voltage in AlGaN/GaN HEMTs Having Passivation Layers with Different Permittivity

Satoh Y., Hanawa H., Horio K., Shibaura Institute of Technology, JP
It is well known that the introduction of filed plate enhances the breakdown voltage in AlGaN/GaN HEMTs. This is because the electric field at the drain edge of the gate is reduced. However, the field [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.