three-dimensional – TechConnect Briefs

Layer-on-layer Assembly of Macroscopic 2D and 3D Carbon Nanomaterial Architectures

Patel S.C., Lalwani G., Alam O., Grover K., Qin Y-X, Sitharaman B., Stony Brook University, US

Although carbon nanomaterials are often labeled as the future replacement for silicon in electronics and a new generation of robust materials, there are major shortcomings in the assembly of carbon nanomaterials into higher order structures. [...]

Three-dimensional Core@Shell Nano-Array Electrodes for Integrated Lithium-Ion Microbatteries

Mao Y., Sun X., Li Q., Lv Y., University of Texas-Pan American, US

In micro/nanoelectromechanical systems (MEMS/NEMS) and biomedical devices, the desired on-board power storage and delivery occur in exceptionally small geometric scales, where amount of energy stored on given footprint (J/mm2) precedes that in either unit weight [...]

Three-dimensional Core@Shell Nano-Array Electrodes for Integrated Lithium-Ion Microbatteries

Mao Y., Sun X., Li Q., Lv Y., University of Texas-Pan American, US

In micro/nanoelectromechanical systems (MEMS/NEMS) and biomedical devices, the desired on-board power storage and delivery occur in exceptionally small geometric scales, where amount of energy stored on given footprint (J/mm2) precedes that in either unit weight [...]

Novel 3D Graphene-Based Materials Prepared by Chemical Vapor Deposition: Process Development and Production Scaling-Up

Polyakova E., Stolyarov D., Zhang J., McCarren C., Graphene Laboratories, US

We have developed methods of CVD processing which are suitable for the industrial production of graphene foam. By optimizing the parameters of CVD growth and choosing the proper nickel support structure, we have tuned the [...]

Synthesis of three-dimensional Mn3O4 nanostructures

Du C.S., Yun J.D., Browning N., Pan N., University of California at Davis, US

Owing to the large specific surface area and other superior properties over their bulk counterparts arising from quantum size effect, nanoscaled and nanostructured materials have attracted considerate research interest and many novel nanoscale materials have [...]

Three-Dimensional Logic Architecture by Four-terminal Electrical Switches (FES) beyond Two-dimensional CMOS Architecture

Fujita S., Abe K., Lee T.H., Stanford University, US

The technology expected after the lithography limit to keep increasing the number of transistors is thought to be either use of new transistors such as CNT by bottom-up process or three-dimensional (3D) architecture. We have [...]