resistivity – TechConnect Briefs

Broadcast Photonic Curing of Metallic Nanoparticle Films

Schroder K.A., McCool S.C., Furlan W.R., Nanotechnologies, Inc., US

A novel and industrially scalable technique is presented for curing metal nanoparticle based films in which a large area uncured film is made highly conductive by exposure to a brief, intense pulse of light from [...]

A New Copper Electrodeposition Scheme to Reduce Void Defects after Chemical Mechanical Polishing

Lin J.Y., Wang Y.Y., Wan C.C., Wang Y.Y., National Tsing Hua University, TW

Deposition of highly (111) oriented conductive layer is required for achieving better electromigration resistance and lower resistivity. Moreover, the amount of void defects decreases as the (111)/(200) ratio increases in CMP process. Hence, we investigated [...]