nanoDAC – TechConnect Briefs

Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages

Keller J., Schulz M., Mrossko R., Wunderle B., Michel B., AMIC Angwandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Nanoscale Deformation Measurements – Concepts for Failure and Reliability Assessment at the Nanoscale

Michel B., Gollhardt A., Keller J., Fraunhofer Institute for Reliability and Microintegration, DE

The paper presents two methods for deformation measurement at the nanoscale level. The first method is based on Scanning Probe Microscopy (SPM) in combination with Digital Image Correlation (DIC). The technique serves as the basis [...]

NanoDAC/fibDAC – Nanodeformation Measurement Techniques for Reliability Analysis of MEMS and NEMS

Keller J., Vogel D., Michel B., Fraunhofer Institute for Reliability and Microintegration (IZM), DE

Recent advances in microtechnology and the development of new electronics and micro/nanosystem devices in automotive industry, communication sector and life science have led to a strong need in material characterization on the micro and nano [...]