LED – Page 2 – TechConnect Briefs

The Application of Ansperical Microlens Array on Direct Backlight System

Tsou C., Lai T., Huang C., Chang C., Wu C., Feng Chia University, TW

Today’s liquid crystal displays (LCDs) have to achieve more brightness and better uniformity in a thinner package, especially for the large-sized LCD panels with direct-type LED backlight system. Different reflective and transmissive characteristics managed by [...]

Electroluminescence from Surface Oxidized Silicon Nanoparticles Randomly Dispersed within a Polymer Matrix

Ligman R.K., Mangolini L., Kortshagen U., Campbell S.A., University of Minnesota, US

For the first time we have demonstrated hybrid silicon organic light emitting diodes. This process uses particles created in a nonthermal silane plasma which are treated by photo oxidation to passivate the surface. Particles were [...]

Fabrication of ZnO hybrid structures and light emitting diode applications

Park S.H., Seo S.-Y., Kwak C.-H., Lee Y.B., Kim S-H, Han S.-W., Chonbuk National University, KR

Vertically well aligned ZnO nanorod arrays with a diameter of 50 - 150 nm were fabricated on Al2O3 substrates with and without GaN interlayers, and consequently covered with a crystalline ZnO film in-situ by a [...]

Multiple Wafer Bonding Offers Increased Throughput of High Brightness LEDs

Pascual D.N., SUSS MicroTec, US

We have developed a new wafer-bonding process and equipment for significantly increasing the throughput of high-brightness light emitting diodes and other devices that could benefit from group semiconductor wafer bonding. I will present this solution [...]

Packaging Design with Thermal Analysis of LED on Silicon Substrate

Tsou C., Huang Y.S., Li H.C., Lai T.S., Feng Chia University, TW

In this paper, we demonstrate a package method for a package component of LED (Light Emitting Diode) using state of the art MEMS technologies and careful materials selection such as using a silicon substrate to [...]

Wurtzitic Boron Nitride on Diamond: The Ultimate Epitaxial Wafer for “Semiconductor on Insulator”

Sung J.C-M, Kinik Company, TW

In last four decades, the miniaturization of semiconductors devices (e.g. integrated circuitry) has been following Moore’s Law with feature (e.g. transistors) density double in about every 18 months. This relentless geometrical progression would require the [...]