TechConnect Briefs
MENU
  • Briefs Home
  • Volumes
  • About ►
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
  • Briefs Home
  • Volumes
  • About
    • TechConnect Briefs
    • Submissions
    • Editors
  • TechConnect
HomeKeywordsink-jet

Keywords: ink-jet

Imbibition dynamics of nano-particulate ink-jet drops on micro-porous media

Hsiao W.-K., Hoath S.D., Martin G.D., Hutchings I.M., Jones S., Chilton N., University of Cambridge, UK
Our study represents the first investigation of imbibition of ink-jet deposited nano-Cu colloid drops on a proprietary coated paper substrate. Using high speed imaging apparatus to capture the depsoition of ink-jet drops, the timescales of [...]

Advancements in Ink-Jet Deposition of Carbon Nanotube Materials for Printed Electronics

Turner S., Brewer Science, US
Advancements in the separation, purification, and post processing of metallic carbon nanotubes are enabling these materials to be used in new printed electronic devices. While CNTs have been researched for over 10 years, recent innovations [...]

Customer-focused batch production via printing technology

Kain A., Mueller C., Reinecke H., University of Freiburg, DE
This paper presents a hot melt printing technology which provides a customer-focused batch production for circuit layers assembly, silicon surface structuring and 3-dimensional surface modification. By the forming properties of hot melt inks and in [...]

Numerical Analysis of Nonlinear Deformation and Breakup of Slender Microjets with Application to Continuous Inkjet Printing

Furlani E.P., Eastman Kodak Company, US
Liquid microjets are inherently unstable and can be modulated in a controlled fashion to create steady streams of picoliter-sized droplets at frequency rates in the hundreds of kilohertz. Such modulation has been achieved using CMOS/MEMS [...]

Adhesive and Conductive – Inkjettable Nano-filled Inks for use in Microelectronics and Microsystems Technology

Meyer E.M., Meyer W., Arp A., Calderone F., Kolbe J., Meyer E.M., Meyer W., Schaefer H., Stuve M., Metalor Technologies SA, CH
The present work demonstrates feasibility of an inkjettable, isotropically electrically conductive adhesive in the form of a silver loaded resin with a 2-step curing mechanism. In the first step, the adhesive is dispensed (jetted) and [...]

About TechConnect Briefs

TechConnect Briefs is an open access journal featuring over 10,000 applications-focused research papers, published by TechConnect and aligned with over 20 years of discovery from the annual Nanotech and the TechConnect World Innovation Conferences.

Full Text Search

TechConnect World

June 17-19, 2024 • Washington, DC

TechConnect Online Community

» Free subscription!

Topics

3D Printing Advanced Manufacturing Advanced Materials for Engineering Applications AI Innovations Biofuels & Bioproducts Biomaterials Cancer Nanotechnology Carbon Capture & Utilization Carbon Nano Structures & Devices Catalysis Chemical, Physical & Bio-Sensors Coatings, Surfaces & Membranes Compact Modeling Composite Materials Diagnostics & Bioimaging Energy Storage Environmental Health & Safety of Nanomaterials Fuel cells & Hydrogen Graphene & 2D-Materials Informatics, Modeling & Simulation Inkjet Design, Materials & Fabrication Materials Characterization & Imaging Materials for Drug & Gene Delivery Materials for Oil & Gas Materials for Sustainable Building MEMS & NEMS Devices, Modeling & Applications Micro & Bio Fluidics, Lab-on-Chip Modeling & Simulation of Microsystems Nano & Microfibrillated Cellulose Nanoelectronics Nanoparticle Synthesis & Applications Personal & Home Care, Food & Agriculture Photonic Materials & Devices Printed & Flexible Electronics Sensors - Chemical, Physical & Bio Solar Technologies Sustainable Materials Water Technologies WCM - Compact Modeling
MENU
  • Sitemap
  • Contact
  • Sitemap
  • Contact

Copyright © TechConnect a Division of ATI | All rights reserved.