digital image correlation – TechConnect Briefs

Three-dimensional Deformation Analysis of MEMS/NEMS by means of X-ray Computer-Tomography

Hammacher J., Dost M., Faust W., Scheiter L., Erb R., Michel B., Fraunhofer ENAS, DE

High resolution x-ray computertomography allows the non-destructive 3D-analysis of materials and compounds. Therefore, information of the internal structure of the material or the device becomes available, which are otherwise only gained by destructive analysis. But [...]

Nanoscale Deformation Measurements for Reliability Assessment of MEMS and NEMS

Keller J., Vogel D., Michel B., Fraunhofer Institute for Reliability and Microintegration (IZM), DE

Recent advances in microtechnology and the development of new electronics and micro/nanosystem devices in automotive industry, communication sector and life science have led to a strong need in material characterization on the micro and nano [...]