deformation measurement – TechConnect Briefs

Nanoscale deformation analysis for fracture mechanical evaluation of interface cracks in electronic packages

Keller J., Schulz M., Mrossko R., Wunderle B., Michel B., AMIC Angwandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Fracture mechanical test methods for interface crack evaluation of electronic packages

Keller J., Maus I., Pape H., Wunderle B., Michel B., AMIC Angewandte Micro-Messtechnik GmbH, DE

The ongoing development of highly integrated electronic packages leads to a steadily increasing number of material interfaces within a package. In combination with increasing harshness (vibration, humidity, temperature) of the system environment the reliability of [...]

Nanoscale Resolution Deformation Measurements at Crack Tips of Nanostructured Materials and Interface Cracks

Keller J., Vogel D., Gollhardt A., Michel B., Fraunhofer Institute for Reliability and Microintegration, DE

The trend towards the application of nanoparticle filled materials in the aerospace and automotive electronics sectors have led to a strong need in material characterization on the micro and nano scale. In addition MEMS and [...]

Nanoscale Deformation Measurements for Reliability Assessment of MEMS and NEMS

Keller J., Vogel D., Michel B., Fraunhofer Institute for Reliability and Microintegration (IZM), DE

Recent advances in microtechnology and the development of new electronics and micro/nanosystem devices in automotive industry, communication sector and life science have led to a strong need in material characterization on the micro and nano [...]