Contact Properties of Titanium Nitride Sidewall Coating for Nanoelectromechanical Electronics
Shavezipur M., Harrison K.L., Lee W-S., Espinosa B., Provine J., Mitra S., Wong H.S.P., Howe R.T., The Ohio State University, US
The performance of hybrid NEM-CMOS low power electronics and logic gates highly depends on the source-drain contact resistance and adhesion force, which affect the power consumption and the pull-in/pull-out hysteresis, respectively. In the present work, [...]