Adhesive and Conductive – Inkjettable Nano-filled Inks for use in Microelectronics and Microsystems Technology
Meyer E.M., Meyer W., Arp A., Calderone F., Kolbe J., Meyer E.M., Meyer W., Schaefer H., Stuve M., Metalor Technologies SA, CH
The present work demonstrates feasibility of an inkjettable, isotropically electrically conductive adhesive in the form of a silver loaded resin with a 2-step curing mechanism. In the first step, the adhesive is dispensed (jetted) and [...]